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Prime & Bond® NT™ by Dentsply Sirona

Prime & Bond® NT™

Dentsply Sirona

DENTSPLY Caulk’s Prime & Bond® NT™ Total Etch Adhesive is based on over sixteen years of trusted, clinically proven PENTA (dipentaerythritol penta acrylate monophosphate) resin technology and can be used in virtually all restorative bonding procedures.

Exclusive nanofillers ensure marginal integrity and exhibit deep penetration into tubules and horizontal interconnects. Nearly 0% sensitivity ensures a pain-free post-op experience for all patients.

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